Detailed Product Description
To meet your different marking requirements
Wide range of applications
Convenient and flexible operating system
Equipment Performance
1 Adopt diode side pump laser as pump headstream.
2 Laser beam with high quality. Work continuously over 24 hours.
3 Low running cost, fast scribing speed and higher precision.
4 Easy to install and operate. good stabilization,free of maintenance
5 Imported key spare parts,simple structure for whole machine.
Applicable fields
1 Scribing for the mono-crystalline sillicon, poly-crystalline sillicon,amorphous-crystalline sillicon,solar cell,wafer in solar industry.
2 Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.
Technical Information
Technical Index
|
Technical Parameter
|
Type specification
|
SDS50
|
Wave lengh of laser
|
1064nm
|
Laser power
|
50W
|
Laser repetition frequency
|
200hz-50khz
|
Max scriber speed
|
140mm/s
|
Scriber line width
|
30μm
|
Work platform size
|
350*350mm
|
Power supply
|
380V(220V)/50HZ/5KVA
|
Cooling ways
|
Outside suspension type constant temperature circulation water cooling
|
Working temperature
|
0-35°C
|
Working humidity
|
5-95%
|
Package
|
Standard Crate for export
|
Work platform
|
The adsorption of double gas warehouse vacuum,the T-model platform is double position works in turn
|
The whole machine include
|
Air pump
|
Exhausting Fan
|
water chiller
|
Accessory box
|
tools, pipes, quality certificate etc.
|
Delivery time
|
10 working days
|
Payment term
|
30% deposit in advance, balance before shipment
|